Mt25ql01gbbb8esf-0sit tr nor flash memory original agent

Device Description

The MT25Q is a high-performance multiple input/output serial Flash memory device. It

features a high-speed SPI-compatible bus interface, execute-in-place (XIP) functionali

ty, advanced write protection mechanisms, and extended address access. Innovative,

high-performance, dual and quad input/output commands enable double or quadru

ple the transfer bandwidth for READ and PROGRAM operations.

Features
• Stacked device (two 512Mb die)
• SPI-compatible serial bus interface
• Single and double transfer rate (STR/DTR)
• Clock frequency
– 133 MHz (MAX) for all protocols in STR
– 90 MHz (MAX) for all protocols in DTR
• Dual/quad I/O commands for increased throughput up to 90 MB/s
• Supported protocols: Extended, Dual and Quad I/O
both STR and DTR
• Execute-in-place (XIP)
• PROGRAM/ERASE SUSPEND operations
• Volatile and nonvolatile configuration settings
• Software reset
• Additional reset pin for selected part numbers
• 3-byte and 4-byte address modes – enable memory
access beyond 128Mb
• Dedicated 64-byte OTP area outside main memory
– Readable and user-lockable
• Erase capability
– Die Erase
– Sector erase 64KB uniform granularity
– Subsector erase 4KB, 32KB granularity
• Erase performance: 400KB/sec (64KB sector)
• Erase performance: 80KB/sec (4KB sub-sector)
• Program performance: 2MB/sec
• Security and write protection
– Volatile and nonvolatile locking and software
write protection for each 64KB sector
– Nonvolatile configuration locking
– Password protection
– Hardware write protection: nonvolatile bits
(BP[3:0] and TB) define protected area size
– Program/erase protection during power-up
– CRC detects accidental changes to raw data
• Electronic signature
– JEDEC-standard 3-byte signature (BA21h)
– Extended device ID: two additional bytes identify
device factory options
• JESD47H-compliant
– Minimum 100,000 ERASE cycles per sector
– Data retention: 20 years (TYP)
Options Marking
• Voltage
– 2.7–3.6V L
• Density
– 1Gb 01G
• Device stacking
– 2 die stacked B
• Device generation B
• Die revision B
• Pin configuration
– HOLD# 1
– RESET and HOLD# 8
• Sector Size
– 64KB E
• Packages – JEDEC-standard, RoHScompliant
– 24-ball T-PBGA 05/6mm x 8mm
(TBGA24)
12
– 16-pin SOP2, 300 mils (SO16W,
SO16-Wide, SOIC-16)
SF
– W-PDFN-8 8mm x 6mm (MLP8 8mm
x 6mm)
W9
• Security features
– Standard security 0
• Special options
– Standard S
– Automotive A
• Operating temperature range
– From –40°C to +85°C IT
– From –40°C to +105°C AT
– From –40°C to +125°C UT