Ucc27324 MOSFET Driver price advantage
explain
Ucc2732x and ucc3732x series high-speed dual MOSFET Drivers provide 4A peak pull current and 4A peak fill current to provide the most needed high-efficiency MOSFET drive in Miller flat area. The unique bipolar and MOSFET hybrid output stages are connected in parallel, which can realize efficient pull current and fill current under low power supply voltage.
It provides a combination of three standard logic options - two-way inverting, two-way in-phase, one-way inverting and one-way in-phase. The input threshold is based on TTL and CMOS, independent of the power supply voltage, and has a wide input hysteresis that can provide excellent noise prevention performance. The ucc2732x and ucc3732x series offer standard soic-8 (d) or pdip-8 (P) packages and thermally enhanced 8-pin powerpad MSOP packages (DGN), greatly reducing thermal resistance to improve long-term reliability.
characteristic
• Bi CMOS output architecture
• provide ± 4A drive current in Miller flat area
• constant current even at low supply voltage
• parallel output for higher drive current
• MSOP powerpad available ™ Encapsulation
• TTL / CMOS input independent of supply voltage
• industry standard pins
Apply
• switching power supply
• DC / DC converter
• photovoltaic inverter, motor control, UPS
Ucc2732x and ucc3732x series high-speed dual MOSFET Drivers provide 4A peak pull current and 4A peak fill current to provide the most needed high-efficiency MOSFET drive in Miller flat area. The unique bipolar and MOSFET hybrid output stages are connected in parallel, which can realize efficient pull current and fill current under low power supply voltage.
It provides a combination of three standard logic options - two-way inverting, two-way in-phase, one-way inverting and one-way in-phase. The input threshold is based on TTL and CMOS, independent of the power supply voltage, and has a wide input hysteresis that can provide excellent noise prevention performance. The ucc2732x and ucc3732x series offer standard soic-8 (d) or pdip-8 (P) packages and thermally enhanced 8-pin powerpad MSOP packages (DGN), greatly reducing thermal resistance to improve long-term reliability.
characteristic
• Bi CMOS output architecture
• provide ± 4A drive current in Miller flat area
• constant current even at low supply voltage
• parallel output for higher drive current
• MSOP powerpad available ™ Encapsulation
• TTL / CMOS input independent of supply voltage
• industry standard pins
Apply
• switching power supply
• DC / DC converter
• photovoltaic inverter, motor control, UPS